BIONIKA DI UF, BR hexagonal interface, positioned Diameter:Ø 3 mm 7 multi-unit platform applications

7 multi-unit platform applications

especially for multi-implant restorations where precise angulation and position transfer are critical

Minimal invasive intervention - transgingival surgical technique possibility

actual colour and geometry may vary depending on the selected dimensions

even under immediate loading conditions

BIONIKA DI UF, BR hexagonal interface, positioned Diameter:Ø 3 mm 7 multi-unit platform applicationsBrand characteristics The BIONIKA DI UF implant system is compatible with the DIO UF platform and features an advanced conical connection (Conical Connection) combined with a hexagonal fit, ensuring micromovement free load transfer and exceptional stability. The 22 cone angle directs forces deep into the implant body, reducing cortical bone stress and promoting long term osseointegration. The spirally micro grooved, self locking, and self compressing